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Process Capabilities

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PROCESS CAPABILITIES


 

SPECIFICATIONS Capabilities Y2024 Capabilities Y2025 SPECIFICATIONS Capabilities Y2024 Capabilities Y2025
HDI structure / 2+N+2 Max.Layer 20 layer 28 layer
Max.board thickness 3.2mm 3.2mm Min inter trace width 3mil 2mil
Min.board thickness 0.4mm 0.4mm Min inter trace space 3mil 2mil
Min.inter Cu thickness 0.5oz 1/3oz Min outer trace width 3mil 2mil
Max.outer Cu thickness 6oz 8oz Min outer trace space 3mil 2mil
Min.outer Cu thickness 3/8oz 1/3oz Min.SMD pad 0.15mm 0.15mm
Min.laser blind hole diameters / 0.06mm Min. isolating ring Drill+0.15mm Drill+0.10mm
Max.laser blind hole diameters / 0.15mm Interlayer offset 0.05mm 0.05mm
Min.hole diameters 0.15mm 0.10mm Pattern/solder mask accuracy ±0.05mm ±0.035mm
Finished Hole Tolerance PTH ±2mil(0.05mm) NPTH ±2mil(0.05mm) PTH ±2mil(0.05mm) NPTH ±2mil(0.05mm) Impedance Tolerance ±5% ±5%
Hole position tolerance ±0.05mm ±0.05mm Working panel size 622~722mm 622~722mm
Through hole aspect ratio 8:1 15:1 Shipping panel size 80~700mm 80~700mm
Blind hole aspect ratio / 1:1 Min.hole space 0.25mm 0.25mm
Quality standard IPC class 3 IPC class 3 Bow/Twist 0.5% 0.5%

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Head Office: 23/F, Delta House, 3 On Yiu Street, Shek Mun, Shatin, N.T., Hong Kong 

Qingyuan Factory Location: 

Circular Economy Industrial Park Of Kingboard, Shijiao Town, Qingcheng District, Qingyuan City, Guangdong Province, China

 

Dongguan Factory Location:

NO.107 CHAJING RD IND CHASHAN DONGGUAN GUANGDONG CN

 

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