Process Capabilities
- Categories:Production Management
- Time of issue:2024-05-31 17:39:02
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Description:
Information
PROCESS CAPABILITIES
SPECIFICATIONS | Capabilities Y2024 | Capabilities Y2025 | SPECIFICATIONS | Capabilities Y2024 | Capabilities Y2025 |
HDI structure | / | 2+N+2 | Max.Layer | 20 layer | 28 layer |
Max.board thickness | 3.2mm | 3.2mm | Min inter trace width | 3mil | 2mil |
Min.board thickness | 0.4mm | 0.4mm | Min inter trace space | 3mil | 2mil |
Min.inter Cu thickness | 0.5oz | 1/3oz | Min outer trace width | 3mil | 2mil |
Max.outer Cu thickness | 6oz | 8oz | Min outer trace space | 3mil | 2mil |
Min.outer Cu thickness | 3/8oz | 1/3oz | Min.SMD pad | 0.15mm | 0.15mm |
Min.laser blind hole diameters | / | 0.06mm | Min. isolating ring | Drill+0.15mm | Drill+0.10mm |
Max.laser blind hole diameters | / | 0.15mm | Interlayer offset | 0.05mm | 0.05mm |
Min.hole diameters | 0.15mm | 0.10mm | Pattern/solder mask accuracy | ±0.05mm | ±0.035mm |
Finished Hole Tolerance | PTH ±2mil(0.05mm) NPTH ±2mil(0.05mm) | PTH ±2mil(0.05mm) NPTH ±2mil(0.05mm) | Impedance Tolerance | ±5% | ±5% |
Hole position tolerance | ±0.05mm | ±0.05mm | Working panel size | 622~722mm | 622~722mm |
Through hole aspect ratio | 8:1 | 15:1 | Shipping panel size | 80~700mm | 80~700mm |
Blind hole aspect ratio | / | 1:1 | Min.hole space | 0.25mm | 0.25mm |
Quality standard | IPC class 3 | IPC class 3 | Bow/Twist | 0.5% | 0.5% |
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